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Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging

By: Material type: TextTextLanguage: English Publication details: Boca Raton CRC Press 2017Description: 322ISBN:
  • 9781138033566
Subject(s): DDC classification:
  • 621.381 531 WEI
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Holdings
Item type Current library Call number Status Notes Date due Barcode
Books Books JC Bose University of Science & Technology Available C 48847
Books Books JC Bose University of Science & Technology Not For Loan R 48625

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