Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging
Material type: TextLanguage: English Publication details: Boca Raton CRC Press 2017Description: 322ISBN:- 9781138033566
- 621.381 531 WEI
Item type | Current library | Call number | Status | Notes | Date due | Barcode |
---|---|---|---|---|---|---|
Books | JC Bose University of Science & Technology | Available | C | 48847 | ||
Books | JC Bose University of Science & Technology | Not For Loan | R | 48625 |
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